Memory arrays

ABSTRACT

Some embodiments include memory arrays. The memory arrays can have global bitlines extending along a first horizontal direction, vertical local bitlines extending perpendicularly from the global bitlines, and wordlines extending along a second horizontal direction which is perpendicular to the first horizontal direction. The global bitlines may be subdivided into a first series at a first elevational level, and a second series at a second elevational level which is different from the first elevational level. The global bitlines of the first series can alternate with the global bitlines of the second series. There can be memory cell material directly between the wordlines and the vertical local bitlines. The memory cell material may form a plurality of memory cells uniquely addressed by wordline/global bitline combinations. Some embodiments include cross-point memory cell units that have areas of about 2F 2 .

TECHNICAL FIELD

Memory arrays.

BACKGROUND

Memory arrays are utilized for tightly packing memory cells withinintegrated circuitry. One type of memory which is particularly amenableto tight packing is cross-point memory.

A memory array may comprise a plurality of wordlines extending along afirst direction, and a plurality of bitlines extending orthogonally tothe wordlines. Cross-point memory may utilize memory cell materialformed at the intersections of the bitlines and wordlines across thearray. The memory cell material may be phase change material, such aschalcogenides. Example chalcogenides are alloys of germanium, antimonyand tellurium.

In addition to the memory cell material, the individual memory cells mayalso comprise access devices which limit current to the memory cellmaterial until a voltage differential across the memory cell materialand the access device reaches a predetermined threshold. The accessdevices may be non-linear electronic devices. Specifically, the accessdevices may be electronic devices which are in a highly resistive stateuntil a voltage differential reaches a predetermined value, whereuponthe electronic devices transform to a conducting state. Example accessdevices are diodes and ovonic threshold switches.

An example prior art cross-point memory array 5 is shown in FIGS. 1-3;with FIG. 1 being a top view, and with FIGS. 2 and 3 beingcross-sectional side views. The cross-sectional views of FIGS. 2 and 3,like all other cross-sectional views in this disclosure, only showfeatures within the planes of the cross-sections. The cross-sectionalviews do not show materials behind the planes of the cross-sections inorder to simplify the drawings.

The top view of FIG. 1 shows that the memory array comprises a pluralityof global bitlines 10-14 that extend along a first horizontal direction,and comprises a plurality of wordlines 20-25 that extend orthogonally tothe global bitlines. The cross-sectional side view of FIG. 2 shows thatthe wordlines of FIG. 1 are actually the top series of a stack ofwordlines, with FIG. 2 showing two underlying series of wordlines. Thewordlines within one of the underlying series are labeled as wordlines20 a-25 a, and the wordlines in the other of the underlying series arelabeled as wordlines 20 b-25 b.

Eighteen wordlines (20-25, 20 a-25 a and 20 b-25 b) are shown in thecross-sectional view of FIG. 2. The eighteen wordlines form atwo-dimensional wordline array having columns of three wordlines, androws of six wordlines.

FIGS. 1-3 show that vertical bitline pillars 30-44 extend upwardly fromthe global bitlines. The bitline pillars extend through the wordlinearray, and are between some of the columns of such wordline array. Thewordlines, bitlines and vertical bitline pillars comprise electricallyconductive material, such as, for example, one or more of variousmetals, metal-containing compositions, and conductively-dopedsemiconductor materials.

Memory cell material 45 (only some of which is labeled) is providedbetween the wordlines and vertical bitline pillars; and access devices46 (only some of which are labeled) are provided between the wordlinesand the vertical bitline pillars. The memory cell material and accessdevice provided between a wordline and a vertical bitline pillartogether form a memory cell 47 (only some of which are labeled).

Although the memory cell material is shown to be a single homogeneouscomposition, it may comprise multiple discrete compositions in someapplications. Also, although the access devices are shown to comprisesingle, homogeneous compositions, the access devices may comprisenumerous discrete compositions; and often do comprise two or moredifferent materials. Further, although only a single access device isshown in each memory cell, there can be multiple access devices in theindividual memory cells. Also, although the memory cell material isshown directly adjacent the vertical bitline pillars, and the accessdevices are shown directly adjacent the wordlines, the relativeorientations of the memory cell material and the access devices may bereversed.

In operation, each individual memory cell may be uniquely addressed by acombination of a global bitline and a wordline. For instance, a voltagedifferential between global bitline 12 and wordline 20 may be utilizedto access the memory cell located at the intersection where wordline 20crosses vertical bitline pillar 36. Such access may be utilized forwriting to the memory cell by placing the memory cell in a specific datastorage state, and for reading from the memory cell by ascertainingwhich data storage state the memory cell is in.

The wordlines within the two-dimensional wordline array of FIG. 2 may beconsidered to be arranged in a plurality of elevational planes 50-52,and accordingly the top view of FIG. 1 may be considered to be showingthe uppermost elevational plane 52 of the wordline array. The memoryarray may be considered to also comprise the elevational planes 50-52,and each memory unit of the memory array may be considered to have anarea along the elevational plane containing such memory unit. The areamay be stated in terms of a minimum feature size, F, utilized to formthe memory array. Such minimum feature size will be the widths of thebitlines, the widths of the wordlines, the widths of the verticalbitline pillars, and the widths of the spaces between the bitlines andthe wordlines if the memory array is fabricated to its absolute minimumdimensions.

The top view of FIG. 1 shows a square perimeter around one of the memoryunits. Such perimeter has sides that are of dimension 2F, andaccordingly the memory unit has an area along elevational plane 52 ofabout 4F². The area is referred to as being “about 4F²,” rather than asbeing absolutely 4F² because the illustrated perimeter assumes that thememory cell material 45 and access device 46 are of negligible size.Since the memory cell material 45 and access device 46 have somephysical dimension, the planar area of the memory unit cell willapproach 4F², but will not be 4F² in an absolute mathematical sense.Alternatively, the planar area of each memory cell unit may beconsidered to be 4F² in a context in which the memory cell material andaccess device are ignored; or in other words may be considered to be 4F²relative to the wordlines, bitlines and spaces consumed by each memorycell unit.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-3 are diagrammatic views of a portion of a prior art memoryarray. FIG. 1 is a top view of the array, and

FIGS. 2 and 3 are diagrammatic cross-sectional side views along thelines 2-2 and 3-3, respectively, of FIG. 1.

FIGS. 4-6 are diagrammatic views of a portion of an example embodimentmemory array. FIG. 4 is a top view of the array, and

FIGS. 5 and 6 are diagrammatic cross-sectional side views along thelines 5-5 and 6-6, respectively, of FIG. 4.

FIG. 7 is a three-dimensional view of a memory array similar to that ofFIGS. 4-6.

FIG. 8 is a diagrammatic cross-sectional view similar to that of FIG. 5,and shows another example embodiment memory array.

FIG. 9 is a three-dimensional view of another example embodiment memoryarray.

FIG. 10 is a three-dimensional view of another example embodiment memoryarray.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

Some embodiments include new memory arrays in which cross-point memorycells may be more tightly packed than is achieved with conventionalmemory arrays. Example embodiments are described with reference to FIGS.4-10.

An example embodiment memory array 100 is shown in FIGS. 4-6. The topview of FIG. 4 shows that the memory array 100 comprises a plurality ofglobal bitlines 110-118 that extend along a first horizontal direction,and comprises a plurality of wordlines 120-125 that extend orthogonallyto the global bitlines. The cross-sectional side view of FIG. 5 showsthat the wordlines of FIG. 4 are actually the top series of a stack ofwordlines, with FIG. 5 showing two underlying series of wordlines; withthe wordlines within one of the series being labeled as wordlines 120a-125 a, and with the wordlines in the other series being labeled aswordlines 120 b-125 b. Accordingly, eighteen wordlines are shown in thecross-sectional view of FIG. 5. The eighteen wordlines form atwo-dimensional wordline array having columns of three wordlines, androws of six wordlines. The two-dimensional wordline array is one exampleof a diversity of different two-dimensional wordline arrays. Suchwordline arrays will generally have at least two wordlines in each rowof the array, and at least two wordlines in each column of the arrays.

FIGS. 4-6 show that vertical bitline pillars 160-182 extend upwardlyfrom the global bitlines. The bitline pillars extend through thewordline array, and are between adjacent columns of such wordline array.The wordlines, bitlines and vertical bitline pillars compriseelectrically conductive material, such as, for example, one or more ofvarious metals, metal-containing compositions, and conductively-dopedsemiconductor materials.

Memory cell material 45 (only some of which is labeled) is providedbetween the wordlines and vertical bitline pillars; and access devices46 (only some of which are labeled) are provided between the wordlinesand the vertical bitline pillars. The memory cell material and accessdevice provided between a wordline and a vertical bitline pillartogether form a memory cell 47 (only some of which are labeled). Thememory cell material 45 and access devices 46 of the example embodimentof FIGS. 4-6 may be the same as the memory cell material 45 and accessdevices 46 of the prior art described above in the “Background” section.

Although the memory cell material is shown to be a single homogeneouscomposition, it may comprise multiple discrete compositions in someapplications. Also, although the access devices are shown to comprisesingle, homogeneous compositions, the access devices may comprisenumerous discrete compositions; and often do comprise two or moredifferent materials. Further, although only a single access device isshown in each memory cell, there may be multiple access devices in theindividual memory cells. Also, although the memory cell material isshown adjacent the vertical bitline pillar, and the access device isshown adjacent the wordline, the relative orientations of the memorycell material and the access device may be reversed.

The cross-sectional view of FIG. 6 shows that some of the globalbitlines 110-118 are formed at a different elevational level than othersof the global bitlines. Specifically, the global bitlines include afirst series containing bitlines 110, 112, 114, 116 and 118 that isformed at one elevational level, and a second series containing bitlines111, 113, 115 and 117 that is formed at a different elevational level.The global bitlines of the first series alternate with those of thesecond series, as shown in FIG. 6.

In operation, each individual memory cell may be uniquely addressed by acombination of a global bitline and a wordline. For instance, a voltagedifferential between global bitline 116 and wordline 121 may be utilizedto access the memory cell located at the intersection where wordline 121crosses vertical bitline pillar 175. Such access may be utilized forwriting to the memory cell by placing the memory cell in a specific datastorage state, and for reading from the memory cell by ascertainingwhich data storage state the memory cell is in.

The wordlines within the two-dimensional wordline array of FIG. 5 may beconsidered to be arranged in a plurality of elevational planes 150-152,and accordingly the top view of FIG. 4 may be considered to be showingthe uppermost elevational plane 152 of the wordline array. The memoryarray may be considered to also comprise the elevational planes 150-152,and each memory unit of the memory array may be considered to have anarea along the elevational plane containing such memory unit. The areamay be stated in terms of the minimum feature size, F, utilized to formthe memory array. Such minimum feature size will be the widths of thebitlines, the widths of the wordlines, the widths of the verticalbitline pillars, and the widths of the spaces between the bitlines andwordlines if the memory array is fabricated to its absolute minimumdimensions.

The utilization of multiple elevational levels for the global bitlinesenables the memory units of the example embodiment memory array of FIGS.4-6 to be more tightly packed than were the memory units of the priorart memory array described in FIGS. 1-3.

The top view of FIG. 4 shows a rectangular perimeter around one of thememory units of the example embodiment memory array. Such perimeter hastwo sides that are of dimension 2F, and two sides that are of dimensionF. Accordingly the memory unit has an area along elevational plane 152of about 2F². The area is referred to as being “about 2F²,” rather thanas being absolutely 2F² because the illustrated perimeter assumes thatthe memory cell material 45 and access device 46 are of negligible size.Since the memory cell material 45 and access device 46 have somephysical dimension, the planar area of the memory unit cell willapproach 2F², but will not be 2F² in an absolute mathematical sense.Alternatively, the planar area of each memory cell unit may beconsidered to be 2F² if the memory cell material and access device areignored; or in other words may be considered to be 2F² relative to thewordlines, bitlines and spaces consumed by each memory cell unit.

FIG. 7 is a three-dimensional view of an example embodiment memory arrayanalogous to that of FIGS. 4-6, which may assist the reader invisualizing such memory array. Identical number is utilized to label thecomponents of FIG. 7 as was used to label the components of FIGS. 4-6.The locations of the wordlines 120-125 are indicated with arrows, butthe wordlines are not shown in order to simplify the drawing.

The embodiment of FIG. 7 differs from that of FIGS. 4-6 in that thememory cell material 45 is contiguous around the vertical bitlinepillars of FIG. 7, and is not contiguous around such vertical pillars inthe embodiment of FIGS. 4-6. Accordingly, FIG. 7 shows a slightlydifferent embodiment than FIGS. 4-6. The embodiment of FIG. 7 also showsthe access devices 46 comprising material that is contiguous around thevertical bitline pillars. In yet other embodiments, the memory cellmaterial may be contiguous around the vertical pillars, but the materialof the access devices may be discontinuous around such pillars.

The embodiments of FIGS. 4-7 have access devices 46 adjacent memory cellmaterial 45 in the individual memory cells 47 of the memory array. Thus,each memory cell unit comprises memory cell material and an accessdevice. In other embodiments the access devices may be removed from theindividual memory cell units to further reduce the size of the memorycell units. Specifically, the access devices may be placed in locationsbetween the vertical pillars and the global bitlines, rather than beingplaced in the individual memory cell units. Accordingly, while thecross-section of FIG. 5 shows an embodiment in which the verticalbitline pillars 170-172 are ohmically connected to the global bitline114, in other embodiments such vertical bitline pillars may be connectedto the global bitline through access devices that respond non-linearlyto increasing voltage (such as, for example, ovonic threshold switches).FIG. 8 shows a cross-sectional view analogous to that of FIG. 5, butshows an embodiment in which a memory array 100 a has access devices 46placed directly between the global bitline 114 and the vertical bitlinepillars 170-172.

The embodiment of FIG. 8 advantageously reduces the size of the memorycells 47 by removing the access devices from such memory cells. In theembodiment of FIG. 8 the only material between the wordlines (forinstance, 120-125) and the vertical bitline pillars (for instance,170-172) is the memory cell material 45.

FIGS. 4-7 show embodiments in which all of the global bitlines are onthe same side of the two-dimensional wordline array (specifically, thetwo dimensional array comprising the wordlines 120-125, 120 a-125 a and120 b-125 b shown in FIG. 5). In other embodiments, some of the globalbitlines may be on an opposite side of the wordline array relative toothers of the global bitlines. FIG. 9 shows a three-dimensional view ofa memory array 200 in which the some of the global bitlines are one sideof a two-dimensional wordline array, and others of the global bitlinesare on an opposing side of the wordline array. Identical numbering willbe used to describe FIG. 9 as is utilized above for describing FIGS.4-7. The wordlines 120-125, 120 a-125 a and 120 b-125 b are not allshown in FIG. 9 in order to simplify the drawing. Instead, onlywordlines 121, 121 a and 121 b are shown, and the locations of wordlines120, 122, 123, 124 and 125 are indicated with arrows.

The embodiment of FIG. 9 may be considered to have some of the globalbitlines 110-118 formed at a different elevational level than others ofthe global bitlines. Specifically, the global bitlines include a firstseries containing bitlines 112, 114 and 116 that is formed at oneelevational level (and specifically, below the wordlines in the shownembodiment), and a second series containing bitlines 111, 113, 115 and117 that is formed at a different elevational level (and specifically,above the wordlines in the shown embodiment). The global bitlines of thefirst series alternate with those of the second series, as shown in FIG.9.

In the embodiment of FIG. 9 the global bitlines of the first series arehorizontally offset from the global bitlines of the second series, sothat the global bitlines of the first series are not directly over theglobal bitlines of the second series. In other embodiments, the globalbitlines of the first series may be directly over the global bitlines ofthe second series, as shown in FIG. 10 with reference to a memory array300. The wordlines are not shown in FIG. 10 in order to simplify thedrawing. However, locations of wordlines 120-125 are indicated witharrows.

The embodiments of FIGS. 9 and 10 may, like the embodiment of FIGS. 4-6,form an array in which the planar area of individual memory cell unitsis 2F² relative to the wordlines, bitlines and spaces consumed by theindividual memory cell units.

The access devices may be in the memory cells of the embodiments ofFIGS. 9 and 10 as shown, or may be between the vertical bitline pillarsand the global bitlines in other embodiments analogous to the embodimentof FIG. 8.

The combination of a global bitline and the vertical pillars attachedthereto may be considered to form a structure analogous to a comb. Inthe embodiment of FIGS. 4-7, such combs may be considered to be withintwo series that are elevationally offset relative to one another; withone series comprising global bitlines 110, 112, 114, 116 and 118, andthe other series comprising global bitlines 111, 113, 115 and 117. Thecombs of both series are parallel to one another and all have thevertical pillars extending in the same direction. In contrast, in theembodiments of FIGS. 9 and 10, one series of combs has the verticalpillars extending upwardly, while the other series of combs has thevertical pillars extending downwardly. For instance, the embodiment ofFIG. 10 has global bitlines 111, 113, 115, and 117 within a first seriesof combs; and has global bitlines 112, 114, 116 and 118 within a secondseries of combs. The first series is exemplified by global bitline 118and the vertical pillars 180, 181 and 182 attached thereto; while thesecond series is exemplified by the combination of global bitline 117and the vertical pillars 178 and 179 attached thereto. The first seriesof combs has vertical pillars extending upwardly, and the second serieshas vertical pillars extending downwardly.

The memory arrays described herein may be incorporated into integratedcircuitry, and thus may be supported by a semiconductor substrate insome applications. The memory arrays may be formed by any suitableprocessing.

The particular orientation of the various embodiments in the drawings isfor illustrative purposes only, and the embodiments may be rotatedrelative to the shown orientations in some applications. The descriptionprovided herein, and the claims that follow, pertain to any structuresthat have the described relationships between various features,regardless of whether the structures are in the particular orientationof the drawings, or are rotated relative to such orientation.

When an element as a layer, region or substrate is referred to as being“against” another element, it can be directly against the other elementor intervening elements may also be present. In contrast, when anelement is referred to as being “directly against” another element,there are no intervening elements present. When an element is referredto as being “connected” or “coupled” to another element, it can bedirectly connected or coupled to the other element, or interveningelements may be present. In contrast, when an element is referred to asbeing “directly connected” or “directly coupled” to another element,there are no intervening elements present.

The term “directly over” is used to indicate vertical alignment ofstructures, and is distinguished from the term “over” which merelyindicates that one structure is above another. Accordingly, a firststructure is over a second structure if the first structure is above thesecond structure regardless of any lateral displacement that may existbetween the first and second structures; and a first structure is“directly over” a second structure if the first structure is verticallyaligned with the second structure.

If one or more substances are referred to as being “directly between” apair of structures, the term “directly between” is used to indicate thatthe one or more substances are sandwiched within a gap between the twostructures.

The embodiments discussed above may be utilized in electronic systems,such as, for example, computers, cars, airplanes, clocks, cellularphones, etc.

In compliance with the statute, the subject matter disclosed herein hasbeen described in language more or less specific as to structural andmethodical features. It is to be understood, however, that the claimsare not limited to the specific features shown and described, since themeans herein disclosed comprise example embodiments. The claims are thusto be afforded full scope as literally worded, and to be appropriatelyinterpreted in accordance with the doctrine of equivalents.

1. A memory array, comprising: a plurality of bitline combs; theindividual combs comprising a horizontally-extending global bitline anda plurality of vertically-extending bitline pillars electricallyconnected to the global bitline; the bitline combs comprising a firstseries and a second series; the second series being vertically offsetrelative to the first series; the bitline combs of the first seriesalternating with the bitline combs of the second series to form astaggered arrangement of the vertically-extending bitline pillars; thehorizontally-extending global bitlines being parallel to one another;wordlines extending orthogonally to the global bitlines; the wordlinesbeing stacked in a two-dimensional array comprising vertical columns andhorizontal rows; the vertical columns of the wordline array comprisingtwo or more wordlines; the bitline pillars extending through thewordline array so that bitline pillars are between adjacent verticalcolumns of the wordline array; and memory cell material directly betweenthe wordlines and the bitline pillars; the memory cell material forminga plurality of memory cells uniquely addressed by wordline/globalbitline combinations.
 2. The memory array of claim 1 wherein thevertical pillars of the first series of bitline combs extend downwardlyfrom the global bitlines, and the vertical pillars of the second seriesof bitline combs extend upwardly from the global bitlines.
 3. The memoryarray of claim 2 wherein individual global bitlines of the first seriesof bitline combs are directly over individual global bitlines of thesecond series of bitline combs.
 4. The memory array of claim 2 whereinindividual global bitlines of the first series of bitline combs areoffset from being directly over individual global bitlines of the secondseries of bitline combs.
 5. The memory array of claim 1 wherein thevertical pillars of the first and second series of bitline combs extendupwardly from the global bitlines.
 6. The memory array of claim 1wherein the vertical pillars of the bitline combs are ohmicallyconnected to the global bitlines.
 7. The memory array of claim 1 whereinthe vertical pillars of the bitline combs are connected to the globalbitlines through access devices that respond non-linearly to increasingvoltage.
 8. The memory array of claim 1 wherein the vertical pillars ofthe bitline combs are connected to the global bitlines through ovonicthreshold switches.
 9. The memory array of claim 1 wherein the memorycell material of multiple memory cells associated with an individualvertical pillar is non-contiguous across a surface of the verticalpillar.
 10. The memory array of claim 9 wherein the memory cell materialis phase change material.
 11. The memory array of claim 1 wherein thememory cell material of multiple memory cells associated with anindividual vertical pillar is contiguous across a surface of thevertical pillar.
 12. The memory array of claim 11 wherein the memorycell material is phase change material.